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- G593-SD0
G593-SD0
(rev. AAX1)
HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 5U DP HGX™ H100 8-GPU 4-Root Port
- NVIDIA-Certified System - Data Center Server
- NVIDIA HGX™ H100 with 8 x SXM5 GPUs
- 900GB/s GPU-to-GPU bandwidth with NVLink® and NVSwitch™
- Dual 5th/4th Gen Intel® Xeon® Scalable Processors
- Dual Intel® Xeon® CPU Max Series
- 8-Channel RDIMM DDR5, 32 x DIMMs
- Dual ROM Architecture
- Compatible with NVIDIA® BlueField®-2 DPUs
- 2 x 10Gb/s BASE-T LAN ports via Intel® X710-AT2
- 8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays
- 12 x LP PCIe Gen5 x16 slots
- 1 x LP PCIe Gen4 x16 slot
- 4+2 3000W 80 PLUS Titanium redundant power supplies
Get a Quote
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
5U
447 x 222.25 x 945
447 x 222.25 x 945
Motherboard
MSB3-G40
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4677
Socket E
Socket E
Chipset
Intel® C741
Memory
32 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
5th Gen Intel® Xeon®: Up to *5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel® Xeon®: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
*5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
5th Gen Intel® Xeon®: Up to *5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel® Xeon®: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
*5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.
LAN
Front side:
2 x 10Gb/s BASE-T LAN ports (1 x Intel® X710-AT2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
2 x 10Gb/s BASE-T LAN ports (1 x Intel® X710-AT2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Front side:
8 x 2.5" Gen5 NVMe/SATA/SAS-4* hot-swappable bays, NVMe from PEX89104
*SAS card is required to support SAS drives.
8 x 2.5" Gen5 NVMe/SATA/SAS-4* hot-swappable bays, NVMe from PEX89104
*SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5
Support optional RAID add-in cards
Support optional RAID add-in cards
Expansion Slots
NVIDIA HGX™ H100 with 8 x SXM5 GPUs
Extension Board CPBG044 x 2:
- 8 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89104
PCIe Cable x 5:
- 2 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
- 2 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
Extension Board CPBG044 x 2:
- 8 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89104
PCIe Cable x 5:
- 2 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
- 2 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
Internal I/O
1 x TPM header
1 x VROC connector
1 x VROC connector
Front I/O
2 x USB 3.2 Gen1
1 x VGA
2 x RJ45
1 x MLAN (default port)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
1 x VGA
2 x RJ45
1 x MLAN (default port)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
1 x MLAN
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
4+2 3000W 80 PLUS Titanium redundant power supplies
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Red Hat Enterprise Linux 8.6 or later (x86_64)
Windows Server 2022 (x64)
Additional certifications:
Red Hat Enterprise Linux 8.6 or later (x86_64)
Windows Server 2022 (x64)
System Fans
Motherboard:
2 x 40x40x28mm (25,000rpm)
4 x 60x60x56mm (24,000rpm)
PCIe slots:
4 x 40x40x28mm (25,000rpm)
3 x 40x40x56mm (29,700rpm)
GPU tray:
6 x 60x60x76mm (21,700rpm)
6 x 80x80x80mm (17,000rpm)
5 x 80x80x80mm (17,200rpm)
2 x 40x40x28mm (25,000rpm)
4 x 60x60x56mm (24,000rpm)
PCIe slots:
4 x 40x40x28mm (25,000rpm)
3 x 40x40x56mm (29,700rpm)
GPU tray:
6 x 60x60x76mm (21,700rpm)
6 x 80x80x80mm (17,000rpm)
5 x 80x80x80mm (17,200rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1200 x 890 x 700 mm
Packaging Content
1 x G593-SD0-AAX1
2 x CPU heatsinks
6 x Carrier clips
1 x L-shape Rail kit
2 x CPU heatsinks
6 x Carrier clips
1 x L-shape Rail kit
Part Numbers
- Barebone w/ NVIDIA module (5/4th Gen): 6NG593SD0DR000ABX1*
- Barebone w/ NVIDIA module (4th Gen): 6NG593SD0DR000AAX1*
- Motherboard: 9MSB3G40NR-000
- L-shape Rail kit: 25HB2-A96102-K0R
- CPU heatsink: 25ST1-24320H-M1R
- Backplane board - CBPG680: 9CBPG680NR-00
- Fan module 80x80x80mm: 25ST2-808037-S1R
- Fan module 80x80x80mm: 25ST2-888032-S1R
- Fan module 60x60x76mm: 25ST2-667630-S1R
- Fan module 60x60x56mm: 25ST2-665620-S1R
- Fan module 40x40x56mm: 25ST2-40562G-A0R
- Fan module 40x40x28mm: 25ST2-44282D-D0R
- I/O board - CDB66: 9CDB66NR-00
- PCIe extension board - CPBG044: 9CPBG044NR-00
- PCIe switch board - CPBG902: 9CPBG902NR-00
- G-SCM board - CDCG120: 9CDCG120UR-00
- Power supply: 25EP0-23000N-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- Barebone w/ NVIDIA module (4th Gen): 6NG593SD0DR000AAX1*
- Motherboard: 9MSB3G40NR-000
- L-shape Rail kit: 25HB2-A96102-K0R
- CPU heatsink: 25ST1-24320H-M1R
- Backplane board - CBPG680: 9CBPG680NR-00
- Fan module 80x80x80mm: 25ST2-808037-S1R
- Fan module 80x80x80mm: 25ST2-888032-S1R
- Fan module 60x60x76mm: 25ST2-667630-S1R
- Fan module 60x60x56mm: 25ST2-665620-S1R
- Fan module 40x40x56mm: 25ST2-40562G-A0R
- Fan module 40x40x28mm: 25ST2-44282D-D0R
- I/O board - CDB66: 9CDB66NR-00
- PCIe extension board - CPBG044: 9CPBG044NR-00
- PCIe switch board - CPBG902: 9CPBG902NR-00
- G-SCM board - CDCG120: 9CDCG120UR-00
- Power supply: 25EP0-23000N-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
OS
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
晶片組
晶片組
版本
檔案大小
日期
Intel® Chipset Driver
Version : 10.1.19485.8386
3.81 MB
Jan 04, 2024
作業系統: Windows Server 2019,Windows Server 2022
網路介面
網路介面
版本
檔案大小
日期
Intel® LAN Driver
Version : 28.2.1
776.69 MB
Jan 04, 2024
作業系統: Windows Server 2019,Windows Server 2022
RAID
RAID
版本
檔案大小
日期
Intel® VROC
Intel® SATA RAID and Utility
Intel® SATA RAID and Utility
Version : 8.5.0.1593
99.21 MB
Jan 04, 2024
作業系統: Windows Server 2019,Windows Server 2022
公用程式
BIOS
說明
版本
檔案大小
日期
Include INTEL-TA-01036 (CVE-2023-45745/CVE-2023-47855); AMI SA50232 (CVE-2023-45236/CVE-2023-45237), and multiple feature updates.
Version : R09
29.63 MB
Apr 12, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.73
147.86 MB
Mar 05, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
版本
檔案大小
日期
BMC firmware with embedded GIGABYTE Management Console
(AST2600)
(AST2600)
Version : 13.05.09
113.83 MB
Jan 26, 2024
英語
使用手冊
說明
版本
檔案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
17.39 MB
Aug 29, 2023
英語
說明
版本
檔案大小
日期
作業系統支援列表
Version : 1.5
0.22 MB
Jan 04, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
RESOURCES
Solutions
AI & AIoT | October 04, 2023
How to Benefit from AI In the Healthcare & Medical Industry
If you work in healthcare and medicine, take some minutes to browse our in-depth analysis on how artificial intelligence has brought new opportunities to this sector, and what tools you can use to benefit from them. This article is part of GIGABYTE Technology’s ongoing “Power of AI” series, which examines the latest AI trends and elaborates on how industry leaders can come out on top of this invigorating paradigm shift.
Tech Guide | September 21, 2023
How to Pick the Right Server for AI? Part Two: Memory, Storage, and More
The proliferation of tools and services empowered by artificial intelligence has made the procurement of “AI servers” a priority for organizations big and small. In Part Two of GIGABYTE Technology’s Tech Guide on choosing an AI server, we look at six other vital components besides the CPU and GPU that can transform your server into a supercomputing powerhouse.
Tech Guide | September 11, 2023
How to Pick the Right Server for AI? Part One: CPU & GPU
With the advent of generative AI and other practical applications of artificial intelligence, the procurement of “AI servers” has become a priority for industries ranging from automotive to healthcare, and for academic and public institutions alike. In GIGABYTE Technology’s latest Tech Guide, we take you step by step through the eight key components of an AI server, starting with the two most important building blocks: CPU and GPU. Picking the right processors will jumpstart your supercomputing platform and expedite your AI-related computing workloads.
AI & AIoT | September 08, 2023
10 Frequently Asked Questions about Artificial Intelligence
Artificial intelligence. The world is abuzz with its name, yet how much do you know about this exciting new trend that is reshaping our world and history? Fret not, friends; GIGABYTE Technology has got you covered. Here is what you need to know about the ins and outs of AI, presented in 10 bite-sized Q and A’s that are fast to read and easy to digest!
AI & AIoT | August 09, 2023
How to Benefit from AI in the Automotive & Transportation Industry
If you work in the automotive and transportation industry, spend a few minutes to read our in-depth analysis of how artificial intelligence has created new opportunities in this sector, and what tools you can use to get ahead. This article is part of GIGABYTE Technology’s ongoing “Power of AI” series, which examines the latest AI-related trends, and how intrepid visionaries can reap the benefits of this exciting paradigm shift.
Tech Guide | June 29, 2023
To Harness Generative AI, You Must Learn About “Training” & “Inference”
Unless you’ve been living under a rock, you must be familiar with the “magic” of generative AI: how chatbots like ChatGPT can compose anything from love letters to sonnets, and how text-to-image models like Stable Diffusion can render art based on text prompts. The truth is, generative AI is not only easy to make sense of, but also a cinch to work with. In our latest Tech Guide, we dissect the “training” and “inference” processes behind generative AI, and we recommend total solutions from GIGABYTE Technology that’ll enable you to harness its full potential.
News
Media Review
Tom\'s Hardware | January 05, 2024
GIGABYTE s’impose comme un leader des serveurs dédiés au calcul d’IA et de machine learning
Les infrastructures de serveurs GIGABYTE sont mises à niveau pour s’adapter aux nouvelles exigences des entreprises, aussi bien en matière d’IA que de calcul hautes performances.
Others
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