H261-PC0 (rev. 100)

HCI Server – Intel DP 2U 4 Nodes Server | Application: 超融合伺服器 & 私有雲/混和雲伺服器

Application:

超融合伺服器私有雲/混和雲伺服器

2U - 4 nodes with rear access to the node trays
2nd Gen. Intel^® Xeon^® Scalable and Intel^® Xeon^® Scalable Processors
Ready for 205W CPU supported
8 x LGA 3647 sockets
Intel^® C621 Express Chipset
6-Channel RDIMM/LRDIMM DDR4, 64 x DIMMs
Supports Intel^® Optane™ DC Persistent Memory
4 x Dedicated management ports
1 x CMC global management port
24 x 2.5" SATA/SAS hot-swappable HDD/SSD bays
8 x Low profile PCIe Gen3 expansion slots
4 x OCP Gen3 x16 mezzanine slots
2200W 80 PLUS Platinum redundant PSU
Optimized performance with Mellanox Infiniband products

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4 Nodes - Rear access
440 x 87 x 840

Motherboard

MH61-HD6

CPU

2nd Generation Intel^® Xeon^® Scalable and Intel^® Xeon^® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor
CPU TDP up to 205W
NOTE:
* If only 1 CPU is installed, some PCIe or memory functions might be unavailable
* This device does not support Intel Omni-Path function

Socket

Per Node:
2 x LGA 3647
Total:
8 x LGA 3647
Socket P

Chipset

Intel^® C621 Express Chipset

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel^® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MHz

Maximum verified DCPMM configuration:

* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)

DCPMM installation locations:
DIMM_P1_( G1, J1)

NOTE:
1. 2933MHz for 2nd Generation Intel^® Xeon^® Scalable Processors only
2. Intel^® Optane™ DC Persistent Memory for 2nd Generation Intel^® Xeon^® Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative

LAN

Per node:
1 x Dedicated management port

Total:
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port

* CMC: Chassis Management Controller, to monitor all status of computing nodes
* Please contact FAE if NCSI function of OCP mezzanine card is needed

Video

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Audio

Storage

Per node:
6 x 2.5" SAS/SATA hot-swappable HDD/SSD bays
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)

Total:
- 24 x 2.5" SAS/SATA hot-swappable HDD/SSD bays
SAS card is required for SAS devices support

RAID

Intel^® SATA RAID 0/1/5/10

Peripheral Drives

Expansion Slots

Per node:
Riser Card CRSH010:
- 1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus)

Riser Card CRSH011:
- 1 x Half-length low-profile slots with PCIe x8 (Gen3 x8 bus)

1 x OCP mezzanine slot with PCIe Gen3 x16 bus

Total:
4 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus)
4 x Half-length low-profile slots with PCIe x8 (Gen3 x8 bus)
4 x OCP mezzanine slots with PCIe Gen3 x16 bus

Internal I/O

Per node:
1 x COM header
2 x SATA 7-pin connectors
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x Reset button

*1 x CMC Status LED
*1 x CMC Reset button

*Only one CMC Status LED and Reset button per system

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
1 x RJ45 MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
4 x RJ45 MLAN
4 x ID LEDs
*1 x CMC global management port

*Only one CMC global management port per system

Backplane I/O

24 x ports
12Gb/s & 6Gb/s compatible

TPM

1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000

Power Supply

2 x 2200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V
+12.12V/ 178.1A
+12Vsb/ 3.5A

NOTE:
* The system power supply requires C19 type power cord

System Management

Aspeed^® AST2500 management controller
AMI MegaRAC SP-X Solution Web interface

Dashboard
JAVA Based Serial Over LAN
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

For Skylake processors:

Windows Server 2012 R2 (x64) Update1
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 (x64) or later
Red Hat Enterprise Linux 7.3 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later

SUSE Linux Enterprise Server 11.4 (x64) or later
SUSE Linux Enterprise Server 12.2 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 16.04.1 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

For Cascade Lake processors:

Windows Server 2012 R2 (x64) Update 1
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later

SUSE Linux Enterprise Server 12.3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.0 Update 3 or later
VMware ESXi 6.5 Update 2 or later
VMware ESXi 6.7 Update 1 or later
VMware ESXi 7.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later

Weight

Net Weight: 27.3 kg
Gross Weight: 45.92 kg

System Fans

8 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1180 x 779 x 300 (mm)

Packaging Content

1 x H261-PC0
8 x CPU heatsinks
1 x Rail Kit
8 x Non-Fabric CPU carrier

Part Numbers

Barebone package: 6NH261PC0MR-00
Spare parts:
- Motherboard: 9MH61HD6NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- Back plane board: 9CBPH0O4NR-00
- Power Supply: 25EP0-222003-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional)
- Ring topology kit: 6NH262Z65SR-00-100 (optional extra)

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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晶片組

版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.17861.8101

3.34 MB

2019/04/18